| Photolithography capabilities(光刻能力) | 内容 | 
|---|---|
| Equipment Model(设备型号) | 
			i-Line 365nm, contact lithography for double-sided alignment i-Line 365nm,接触式光刻,可实现双面对准  | 
	
| Wafer size(晶圆尺寸) | 
			6" Round, 6" Square, 8" Round 6” 圆、6” 方、8” 圆  | 
	
| Resolution(最小分辨率) | 4um @line/space | 
| Alignment accuracy (TSA)(套刻精度(TSA)) | ≤1μm | 
| Alignment accuracy (BSA)(套刻精度(BSA)) | ≤1.5μm | 
| Product Size(产品尺寸) | 内容 | 
| Material(材料) | 
			Optical glass, silicon wafers, sapphire, etc. 光学玻璃、硅片、蓝宝石等  | 
	
| Microstructure size(微结构尺寸) | Min 5μm @line space | 
| Dimensional accuracy(尺寸精度) | ±2 um @ 8inch wafer | 
| Dimensional Uniformity(尺寸均匀性) | ≤5% | 
| Optical performance(分光特性) | 内容 | 
| Optical coating | 540/575/615/660/710nm,FWHM ≦40nm,Tmax>60% |